https://doi.org/10.1051/epjap:2000118
The electrical activity of IMPATT diodes on a nanometric scale by X-STEBIC method
1
Laboratoire de Physique du Solide, CNRS-ESPCI, 10 rue Vauquelin, 75231 Paris Cedex 05, France
2
Institut d'Électronique Fondamentale, Université Paris XI, Bât. 220, 91405 Orsay Cedex, France
3
Laboratoire de Génie Électrique de Paris, SUPELEC, plateau du Moulon, 91192 Gif-sur-Yvette, France
Corresponding author: jean-yves.laval@espci.fr
Received:
4
October
1999
Revised:
15
February
2000
Accepted:
15
February
2000
Published online: 15 April 2000
The Scanning Transmission Electron Beam Induced Current Technique (STEBIC) was
adapted to allow the analysis of local electrical activity in semiconductor diodes. This
technique enabled us to analyse the in situ properties of IMPATT junctions (IMPact
Avalanche Transit Time: which are Si doped multijunctions). The samples were
thinned down as cross-sections, to be observed and analysed in transmission electron
microscopy. The current induced by the electron beam was collected by the depleted zone. By
synchronising measurements with each scan of the electron beam, the electrical activity can
be viewed at a very local scale. The STEBIC signal was simulated by using a model of drift-
diffusion. The prevailing role of the recombination rate on the form of the STEBIC profile
was evidenced. We found that the spatial resolution of this method depends on the thickness
of the sample and on the zone where the measurement is taken. We show that the spatial
resolution of this method is optimal when the electron beam is localised in the p/n depleted
zone. In thin areas, the maximum spatial resolution is calculated to be
nm. Outside the electric field the transport phenomena are governed by the diffusion of
carriers and the signal width is widened.
PACS: 73.40.Lq – Other semiconductor-to-semiconductor contacts, p-n junctions, and heterojunctions / 73.50.Gr – Charge carriers: generation, recombination, lifetime, trapping, mean free paths
© EDP Sciences, 2000