https://doi.org/10.1051/epjap/2009091
Temperature mapping of Al0.85In0.15N/AlN/GaN high electron mobility transistors through micro-photoluminescence studies
École Polytechnique Fédérale de Lausanne (EPFL),
Institute of Quantum Electronics and Photonics,
1015 Lausanne, Switzerland
Corresponding author: marcus.gonschorek@epfl.ch
Received:
17
February
2009
Accepted:
18
March
2009
Published online:
20
May
2009
Crack-free lattice-matched Al0.85In0.15N/GaN heterostructures were
grown on sapphire substrates with barrier thicknesses up to 100 nm which
exhibit very high polarization-induced electron sheet density ( cm−2) located at the heterointerface. These layers have
been further processed as high electron mobility transistors (HEMTs).
Optical characterization of these structures was carried out by
photoluminescence and microphotoluminescence (
PL) for different biased
voltages. The insertion of an InGaN back-barrier unambiguously reveals that
spatially direct optical recombinations occur within the AlInN alloy. Since
the GaN excitonic bandgap is very sensitive to local temperature changes,
the
PL technique allows mapping very precisely the actual local
temperature distribution in biased HEMT devices. For a gate length of 1.5
m
temperatures up to 1130 K were found at a drain-source voltage of 20 V
thus indicating the presence of a hot phonon bath.
PACS: 73.50.Fq – High-field and nonlinear effects / 78.66.Fd – III-V semiconductors / 68.60.Dv – Thermal stability; thermal effects
© EDP Sciences, 2009