Eur. Phys. J. Appl. Phys. 35, 17-27 (2006)
https://doi.org/10.1051/epjap:2006064

CuO thin films thermal conductivity and interfacial thermal resistance estimation

¹ Laboratoire inter établissement `TRansferts Écoulements Fluides Énergétique', UMR 8508, École Nationale Supérieure d'Arts et Métiers, Esplanade des Arts et Métiers, 33405 Talence Cedex, France
² Institut de Chimie de la Matière Condensée de Bordeaux, UPR-CNRS 9048, 87 avenue du Docteur Schweitzer, 33608 Pessac Cedex, France

Corresponding author: andrzej.kusiak@bordeaux.ensam.fr

Received: 19 July 2005
Revised: 8 March 2006
Accepted: 9 April 2006
Published online: 23 June 2006

Abstract

The thermal conductivity and the interface thermal contact resistance of four different in thickness CuO films, obtained by PVD on a tungsten carbide substrate were investigated with a developed modulated photothermal method based on infrared measurement. According to the knowledge of the substrate thermophysical properties, the gain between the thermal perturbation and the response of the sample was used as the experimental data. The results show the dependence of the effective longitudinal thermal conductivity on the film thickness. Scanning electron microscopy observations reveal the strong anisotropy and columnar structure of the deposits. Moreover, the chemical composition of films was tested. A similar composition for each film was also verified.